Bondable surfaces

The special coating of components facilitates/enables the connection of different components or the contact of e.g. electronic components with the carrier material. The bonding itself is carried out using various technologies, such as aluminum wire bonding, gold wire bonding or ribbon bonding. Common areas of application for bondable surfaces are control units and sensors for various sectors, such as the automotive and electronics industries.

Nesper has many years of experience in the realization of bondable functional surfaces. In our own bonding laboratory, we use various bonding machines and state-of-the-art testing equipment such as a scanning electron microscope to ensure that every surface has exactly the properties that our customers have defined. This also underpins our high quality requirements in accordance with a zero-defect strategy. We offer two bondable coating systems:

silver
Copper (on request)

Progress takes shape

Inline feeding of ceramic pins

Inline feeding of ceramic pins

The technique of inline feeding of ceramic pins into copper base material.

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Media-tight overmolding

Media-tight overmolding

Expansion of the hybrid technology to include a dimension for tight connections to the external medium.

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Pressfit EloPin® – press-fit zone

Pressfit EloPin® – press-fit zone

The pioneering technology for sophisticated electronic components. It is preferably used for assembling printed circuit boards.

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Bondable surfaces

Bondable surfaces

The special coating of components facilitates/enables the connection of different components.

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