Inline feeding of ceramic pins
in copper base material

Nesper has mastered the technology of inline feeding of ceramic pins in copper base material. The non-conductive material allows safe separation of electrical currents and other components of the part. We also meet complex requirements in this area with a high understanding of quality and absolute adherence to deadlines. Everything comes from a single source – from consulting and development to integration into your production processes.

Progress takes shape

Inline feeding of ceramic pins

Inline feeding of ceramic pins

The technique of inline feeding of ceramic pins into copper base material.

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Media-tight overmolding

Media-tight overmolding

Expansion of the hybrid technology to include a dimension for tight connections to the external medium.

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Pressfit EloPin® – press-fit zone

Pressfit EloPin® – press-fit zone

The pioneering technology for sophisticated electronic components. It is preferably used for assembling printed circuit boards.

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Bondable surfaces

Bondable surfaces

The special coating of components facilitates/enables the connection of different components.

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