Innovations
from Nesper

Always one idea ahead

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Gaining and maintaining a competitive edge requires the right partner. At Nesper, we know how to turn developments into successes. Successes that inspire your business. That’s why we are innovation partners to many companies from a wide range of industries. With ideas and pioneering know-how, we work together to redefine the limits of what is technically feasible and often create groundbreaking, individual solutions. Benefit from our exceptional performance with bondable surfaces, ceramic pins or Pressfit Elopin and shape progress according to your wishes – with Nesper.

Progress takes shape

Inline feeding of ceramic pins

Inline feeding of ceramic pins

The technique of inline feeding of ceramic pins into copper base material.

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Media-tight overmolding

Media-tight overmolding

Expansion of the hybrid technology to include a dimension for tight connections to the external medium.

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Pressfit EloPin® – press-fit zone

Pressfit EloPin® – press-fit zone

The pioneering technology for sophisticated electronic components. It is preferably used for assembling printed circuit boards.

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Bondable surfaces

Bondable surfaces

The special coating of components facilitates/enables the connection of different components.

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