Pressfit EloPin® – press-fit zone
Contact with the future.

Press-fit technology is an innovative, forward-looking technology for sophisticated electronic components. It is the preferred method for assembling printed circuit boards. Essentially, component pins, connectors or individual contacts are pressed into metallized holes on a PCB. This mechanical plug connection avoids the undesirable consequences of conventional soldering technology, such as soldering errors, flux problems or thermal stress. Further advantages are the more economical and, if required, double-sided assembly process.

Nesper Pressfit Elopin®

Nesper offers many years of experience in the production of press-fit zones. The results for our customers are maximum precision and absolute reliability. This applies in particular to the Pressfit EloPin® that we produce. The Nesper manufacturing process allows the advantages of the patented plug-in connection to be fully utilized:

Technically very clean, as no chip formation

Resilient, robust and vibration-resistant thanks to high stability

Reliable because gas-tight

Flawless functionality in the entire tolerance range of the PCB hole

Mechanically less stressed PCB due to gentle press-fit process

Low contact resistance

The EloPin® is used in demanding sectors such as mechanical engineering, automotive and medical technology. Areas for which Nesper offers complex solutions from a single source.

Elopin® in all sizes

DesignationBelt thickness (mm)PCB end hole (mm)PCB thickness (x 1 mm)
EloPin 04-060,40,61,0
EloPin 06-100,61,01,44 (1,0)
EloPin 08-1450,81,451,44
EloPin 08-160,81,61,44
EloPin 12-201,22,01,44

Technical data

EloPin designation04-0606-1008-14508-1612-20
Press-in force, max100 N100 N160 N160 N200 N
Press-in force, typical20-60 N (x1)65 N115 N85 N160 N
Ejection force, min20 N30 N40 N50 N50 N
Pushing force, typical35-70 N (x1)60 N135 N105 N110 N
Contact resistance, max1 mOhm1 mOhm1 mOhm1 mOhm1 mOhm
Contact resistance, typical0.05 mOhm0.01 mOhm0.01 mOhm0.01 mOhm0.01 mOhm
Current carrying capacity (x2)not testedapprox. 8 Aapprox. 25 Aapprox. 25 Aapprox. 45

Progress takes shape

Inline feeding of ceramic pins

Inline feeding of ceramic pins

The technique of inline feeding of ceramic pins into copper base material.

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Media-tight overmolding

Media-tight overmolding

Expansion of the hybrid technology to include a dimension for tight connections to the external medium.

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Pressfit EloPin® – press-fit zone

Pressfit EloPin® – press-fit zone

The pioneering technology for sophisticated electronic components. It is preferably used for assembling printed circuit boards.

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Bondable surfaces

Bondable surfaces

The special coating of components facilitates/enables the connection of different components.

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